The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and support multi-material (Silicon, III-V, Glass) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities.
Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment
Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.
Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.
Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.
Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.
Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.
Other related functions as assigned.
Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field
10+ years of relevant industry experience in semiconductor IC design
Previous supervisory experience with small to medium-sized teams
Strong understanding of semiconductor device physics and mixed signal circuit design
Excellent problem-solving skills and attention to detail
Strong communication and teamwork skills
Ability to manage multiple projects in a fast-paced environment
Proficiency in industry-standard EDA software for circuit and/or package design
Relevant education and experience may be substituted as appropriate.
Master's or higher degree in relevant semiconductor engineering fields
Experience with 2.5D and 3D semiconductor packaging technologies
Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)
Strong background in DFT/DFM methodologies and BIST techniques
Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)
Experience in a startup or R&D environment
TIE Pays Industry Competitive Salaries
On-site work in a scientific research environment and prototyping facility
Dynamic work conditions with multiple partners/customers
Occasional work outside standard office hours during peak periods
Repetitive use of a keyboard at a workstation
Use of manual dexterity (ex: using a mouse)
Climbing of stairs
Resume/CV
3 work references with their contact information; at least one reference should be from a supervisor
Letter of interest
Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.
Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.
Tagged as: Life Sciences
Manager, Clinical Scientist The Manager Clinical Scientist assists in the development, evaluation, planning and execution of clinical studies and ensures...
ApplyProject Manager III (PM3) The University of Texas at Austin is seeking to hire a project manager III (PM3) with...
ApplyManager In Clinical Sciences, Oncology As a Manager in Clinical Sciences, Oncology, you will assist in the development, evaluation, planning...
ApplySenior Manager, Internal Medicine, Clinical Scientist The Senior Manager, Internal Medicine, Clinical Scientist leads in the development, evaluation, planning and...
ApplyLate-Stage Oncology Clinical Trial Expert You will be responsible for scientific oversight, data integrity and quality of clinical trial(s) in...
ApplyClinical Scientist Role You will provide clinical and scientific oversight and support for multiple, global Phase 1 – 4 clinical...
ApplyPlease visit utaustin.wd1.myworkdayjobs.com.
Don't forget to mention that you found the position on jobRxiv!
