Design Engineering Manager, Texas Institute for Electronics Full-time

Design Engineering Manager

The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and support multi-material (Silicon, III-V, Glass) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities.

Responsibilities

• Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment

• Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.

• Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.

• Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.

• Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.

• Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.

• Other related functions as assigned.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field

• 10+ years of relevant industry experience in semiconductor IC design

• Previous supervisory experience with small to medium-sized teams

• Strong understanding of semiconductor device physics and mixed signal circuit design

• Excellent problem-solving skills and attention to detail

• Strong communication and teamwork skills

• Ability to manage multiple projects in a fast-paced environment

• Proficiency in industry-standard EDA software for circuit and/or package design

Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Master's or higher degree in relevant semiconductor engineering fields

• Experience with 2.5D and 3D semiconductor packaging technologies

• Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)

• Strong background in DFT/DFM methodologies and BIST techniques

• Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)

• Experience in a startup or R&D environment

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• On-site work in a scientific research environment and prototyping facility

• Dynamic work conditions with multiple partners/customers

• Occasional work outside standard office hours during peak periods

• Repetitive use of a keyboard at a workstation

• Use of manual dexterity (ex: using a mouse)

• Climbing of stairs

Required Materials

• Resume/CV

• 3 work references with their contact information; at least one reference should be from a supervisor

• Letter of interest

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.