The Postdoctoral Fellowship position at The University of Texas at Austin is to advance research in microelectronics, advanced packaging, and design enablement. Aiming to develop early-career researchers by engaging them in both applied and fundamental research. Fellows will collaborate with a team of engineers and scientists on cutting-edge advancements in heterogeneous integration.
Conduct and lead applied and fundamental research in the areas of microelectronics, advanced packaging, and design enablement.
Serve as part of a larger team of engineers and scientists working on cutting-edge advancements in heterogeneous integration.
Other related functions as assigned.
A PhD received within the last 3 years in Electrical and/or Computer Engineering or a closely related discipline with a focus on integrated circuit design, packaging, and EDA (electronic design automation).
Solid understanding of the IC physical design flow, familiarity with commercial EDA tools (e.g., Cadence, Synopsys/Ansys, Siemens).
Willingness to work on cross-stack optimizations and learn new skills.
Experience with multi-physics simulations for thermal, mechanical, and reliability analysis.
Prior experience in EDA research and development.
Prior chip tape-out experience (digital/analog/RF ICs, etc.)
Familiarity with applied ML, modeling, and optimization.
$70,000 + depending on qualifications
Work is performed on-site in a scientific research environment and prototyping facility with dynamic work conditions collaborating simultaneously with many partners/customers in parallel.
Work outside standard office hours could be required on an occasional basis during peak periods and special events.
Personal protection equipment (furnished)
May work around standard office conditions
Repetitive use of a keyboard at a workstation
Use of manual dexterity (ex: using a mouse)
Resume/CV
3 work references with their contact information; at least one reference should be from a supervisor
Letter of interest (optional)
Tagged as: Life Sciences
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