Postdoctoral Fellow (PREP0003537) Full-time

Postdoctoral Fellow

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.

Research Title: Accelerated Laboratory Testing and Failure Analysis for Advanced Semiconductor Packaging

The work will entail: The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: accelerated laboratory testing, polymer degradation, mechanical characterizations for interfaces of multilayers, and failure analysis using microscopy, spectroscopy, or X-ray based techniques.

If selected, you will play a significant role in the projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long-term reliability of advanced packaging reliability and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.

Key responsibilities will include but are not limited to: Developing new test methods for thin film interfacial adhesion. Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging. Conducting in-situ environmental digital image correlation (DIC) to quantify package and assembly deformation during thermal cycling Developing FIB/TEM/SEM analytical methods and X-ray-based techniques for complex advanced packaging systems. Developing robust datasets of materials and interface properties before and after aging for reliability models. Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.

Qualifications: Live in the United States. Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering /Physics/Chemical Engineering/Chemistry. Strong oral and written communication skills. Experience in: Reliability testing and modeling Nano- and micro-scale materials characterization Degradation or failure analysis of complex semiconductor systems Experience in advanced semiconductor packaging preferred.