Research Engineer (Heterogeneous Integration), (IME) Full-time

Research Engineer (Heterogeneous Integration), (IME)

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics, essential for the next generation of heterogeneous chiplet integration. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

We are seeking a highly skilled and motivated Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Key Responsibilities:

• Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
• Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

Requirements:

• Educational Background: Master’s degree or bachelor’s degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage.