Senior /Lead Research Engineer (FOWLP/2.5D/3D package integration) (HI), IME Full-time

Senior /Lead Research Engineer (FOWLP/2.5D/3D package integration) (HI), IME

The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state-of-the-art advanced packaging platform technologies, such as 2.5D/3D IC and Co-packaged optics. Development of critical modules includes fine pitch multi-layer redistribution layers (RDL), micro bumping, Temporary bonding and debonding process flow, flip chip thermal compression bonding, chip-to-wafer and wafer-to-wafer fusion/hybrid bonding capabilities, developing fan-out wafer level packaging, 2.5D interposer, and 3D chip stacking process integration flows for Heterogeneous Integration of chiplets.

The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external ecosystem stakeholders

Key Responsibilities:

• Develop advanced packaging technology platforms (fan-out packaging, 2.5D interposer and 3D stacking) capabilities and novel process integration approaches for heterogeneous chiplets integration.
• Work with design and process module teams to establish design rules and PDK for advanced packaging technologies.
• Lead capability development projects for internal and external industry projects involving new materials, advanced process integration approaches, and new test vehicle designs with minimum manageable risks.
• Engage and manage internal and external stakeholders for project activities execution and provide timely updates on schedule and deliverables.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Collaborate with cross-functional teams such as design, Unit process team, yield improvement, and external partners, including materials, equipment, customers and universities, to identify technology gaps, define technology roadmap and drive the development.
• Inspire and mentor students in semiconductor technology, contributing to workforce development in advanced packaging.
• Customer/partner engagement: ability to present technical content to customers and senior stakeholders; drive joint development (JDP/NRE).
• Mentoring junior engineers, influencing without authority, and ownership of module roadmaps.
• Should be able to work hands-on in the cleanroom and learning new processes and metrology equipment.

Job Requirements:

• Bachelor's or Master's in Materials Science & Engineering, Mechanical, Chemical, Electronics/ Electrical & Computer Engineering, Physics, Chemistry or a closely related field.
• 5-10 years of experience in semiconductor experience with expertise in Cu backend integration and exposure to advanced packaging technologies (flip-chip, FOWLP, 2.5D/3D, TSV, hybrid/fusion bonding).
• Broad hands-on knowledge of one or more unit processes such as lithography, etch (damascene, TSV via-last/middle); deposition (ALD/CVD/PVD, including high-AR barrier and seed layers); electroplating and alternative via-fill materials, CMP for hybrid bonding; fusion/hybrid bonding; wafer thinning; and dicing is preferred.
• Proven ability to work effectively in a diverse, matrixed environment and collaborate with cross-functional departments.
• Strong analytical/problem-solving skills (Ishikawa, Seven Basic Quality Tools, brainstorming) and proficiency with DOE and SPC (JMP/Minitab).
• NPI to HVM ramp experience: process window definition, control plans, and yield/cost improvement through pilot to high-volume manufacturing (foundry/OSAT).
• Reliability & standards: working knowledge of JEDEC/IPC/JESD (e.g., HTS, TC, HAST, BLR, EM), and failure analysis flows (X-ray, CSAM, FIB/SEM-EDX).
• Excellent written and verbal communication abilities.
• Demonstrated ability to manage multiple projects and priorities in a research and translational environment.
• Able to work effectively with multi-ethnic, multicultural teams and to build inclusive, high-performing teams.

What We Offer:

• The opportunity to work on cutting-edge research projects in advanced packaging and heterogeneous integration.
• A collaborative & interdisciplinary work environment and access to state-of-the-art facilities and resources.
• File intellectual property (IP) promptly for new research findings.
• Publish research in peer-reviewed journals and present findings at international conferences.
• Researchers have access to advanced laboratories and characterisation equipment, fostering innovation and enabling the development of groundbreaking technologies. The institute encourages interdisciplinary collaboration and offers opportunities for professional growth and development.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!