Senior or Principal Signal Power Integrity and Multiphysics Engineer, Texas Institute for Electronics Full-time

Senior Or Principal Signal Power Integrity And Multiphysics Engineer

Texas Institute for Electronics

Austin, TX

Position open to all applicants. Weekly scheduled hours: 40. FLSA status: To be determined at offer. Position duration: Expected to continue.

General Notes

Applicants must be eligible to work in the United States on a full-time basis for any employer without sponsorship.

About TIE

The Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our Mission

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Our Impact

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Our Technology

Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America's Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city's innovative spirit.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

For more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human Resources

Purpose

This role is to lead and execute comprehensive Signal Integrity (SI), Power Integrity (PI), and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities

• Own and execute hands-on SI/PI and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
• Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
• Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
• Run end-to-end simulation workflows including EM extraction, S-parameter generation, PDN impedance analysis, crosstalk/eye diagram simulations, thermal/structural reliability checks, and co-simulation across domains.
• Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
• Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
• Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
• Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
• Other related functions as assigned.

Required Qualifications

Senior Engineer:

• BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
• 8 or more years of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.

Principal Engineer:

• 12 or more years of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms. For both titles:
• Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
• Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
• Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
• Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
• Startup DNA. You're energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
• Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
• Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
• Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.
• Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
• Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
• Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• May work in all weather conditions
• May work in extreme temperatures
• May work around chemical fumes
• Climbing of stairs