Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. The candidate will be responsible to advance the state-of-the-art chip-to-wafer and wafer-to-wafer fusion/hybrid bonding capabilities, develop 2.5D interposer and 3D chip stacking process integration flows for Heterogenous Integration of chiplets for Artificial Intelligence and High-Performance Computing applications, and conducting electrical, thermal and mechanical reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Key Responsibilities
Job Requirement/Qualifications
Tagged as: Life Sciences
Research Associate The School of Materials Science and Engineering (MSE) provides a vibrant and nurturing environment for staff and students...
ApplyValidation Scientist Ii As part of the Thermo Fisher Scientific team, you'll discover meaningful work that makes a positive impact...
ApplyResearch Scientist Position At Nanyang Technological University Young and research-intensive, Nanyang Technological University, Singapore (NTU Singapore) is ranked among the...
ApplyScientist/Senior Scientist I (Advanced Optical Technology), IMRE We are seeking a highly motivated Materials Scientist to work on quantum emitter...
ApplyW2W Bonding Research Scientist (APM), IME Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing,...
ApplyJob Posting School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built...
ApplyPlease visit careers.a-star.edu.sg.
Don't forget to mention that you found the position on jobRxiv!
