Thermal Mechanical Modeling Engineer Full-time

Thermal Mechanical Modeling Engineer

The role is to lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities include:

• Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
• Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
• Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
• Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.
• Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
• Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
• Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
• Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
• Other related functions as assigned.

Required Qualifications

Engineer:

• BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
• 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
• Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
• Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
• Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
• You're energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
• Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
• Location. Austin, Texas is required for close collaboration with our engineering teams and partners.

Senior Engineer:

• MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
• 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
• Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
• Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.

Preferred Qualifications

Engineer/Senior Engineer:

• Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
• Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
• Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains.
• Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• Uniforms and/or personal protection equipment (furnished)
• May work in all weather conditions
• May work in extreme temperatures
• May work around chemical fumes
• May work around standard office conditions
• May work around biohazards
• May work around chemicals
• May work around electrical and mechanical hazards
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)
• Climbing of stairs
• Climbing of ladders
• Lifting and moving 30 pounds

Work Shift

• Monday – Friday
• Occasional nights/weekends required

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of interest