Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.
A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.
Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.
Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.
UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:
The Director of Software Engineering will lead the architecture and implementation of a scalable AI infrastructure platform, managing a high-caliber engineering team to ensure performance, security, and reliability while collaborating cross-functionally to align engineering priorities with product goals.
TIE pays industry-competitive salaries
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