Product Engineer I – II or Sr. Product Engineer, Texas Institute for Electronics Full-time

Product Engineer I – II Or Sr. Product Engineer, Texas Institute For Electronics

The Texas Institute for Electronics (TIE) is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogeneous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.

TIE is part of the Cockrell School of Engineering at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation's most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin — named “America's Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Cockrell School embodies the city's innovative spirit. Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders.

At UT Austin, we say “What starts here changes the world.” As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research. Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets.
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Purpose

Responsible for IC & Test Structure product validation and optimization of manufacturing & Design processes to improve 3DHI yield, performance, & reliability across a wide range of customer heterogeneous materials and micro-systems. Work closely with circuit/layout design, process integration, and TEST teams to define and create work flow solutions, and methodologies to ensure products produced at TIE have the highest possible performance, quality, & reliability.

Responsibilities

• Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKM's (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.
• Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit).
• Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation correlation accuracies to understand and quantify process variations and their impacts on performance, yield, and reliability.
• Drive corrective actions across cross-functional teams to fix and identify root-cause systematic yield and reliability issues. Perform Failure analysis on products manufactured at TIE
• Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements. Design and execute appropriate DOE's
• Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement.
• Define product DFT & DFM requirements and methodologies. Help with ATE Test plan definitions and requirements.
• Bench/lab validation and characterization of various IC solutions and test structures to understand multi-physics impacts of our 3DHI processes.
• Leverage data analytics to drive product yield and reliability optimization.
• Own entire product life cycle from bring up, performance/yield/reliability optimization, to customer qualification.
• Collaborate with customers to understand and resolve field failures.

Required Qualifications

• Product Engineer I: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science or relevant field.
• Product Engineer II: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science, and a minimum of three years of relevant industry experience.
• Senior Product Engineer: Bachelor's degree in Electrical Engineering, Semiconductor Physics, or Materials Science, and a minimum of ten years of relevant industry experience.
• Strong understanding of semiconductor device physics and mixed signal IC behaviors.
• Proficient programming skills in languages such as Python, MATLAB, C/C++, or Perl… for data analysis, and automation.
• Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.
• Excellent analytical and problem-solving skills, as well as attention to detail.
• Ability to thrive in a fast-paced environment and manage multiple projects simultaneously.
• (Eng II or Senior): Prior experience in semiconductor design, product engineering, process Integration/manufacturing, Test, or packaging required.

Relevant education and/or industry experience may be substituted as appropriate.

Preferred Qualifications

• Master's degree or PhD in semiconductor engineering fields such as Electrical Engineering, Materials Science, Semiconductor Physics or other relevant disciplines.
• Experience or Interest in (for entry level) at least one of the following areas: IC/Micro-system Design, Product Validation, Test, Process or wafer fab Integration, Semiconductor Packaging manufacturing, Thermal/stress optimization, and/or quality assurance, ATE and/or Bench validation of IC's or process test structures, Semiconductor Failure analysis. (SEM/CSAM experience…), Materials packaging/stress/strain evaluations and process controls, Data analytics using scripting/programming putting results into tables/graphs/reports. (JMP, Power BI, Excel…), BIST definition and/or validation. Design & TEST BKM, and Apps engineering / Micro-system Product definition and requirements.
• Experience in a startup or research and development (R&D) environment.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• Work is performed on-site in a scientific research environment and prototyping facility with dynamic work conditions collaborating simultaneously with many partners/customers in parallel.
• Work outside standard office hours could be required on an occasional basis during peak periods and special events.

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of interest