Yield Enhancement Engineer, Texas Institute for Electronics Full-time NEW

Yield Enhancement Engineer, Texas Institute for Electronics

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, pre-eminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America's Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city's innovative spirit.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
• For more details, please see Benefits | Human Resources and UT Austin Employee Experience | Human Resources

Due to the nature of the work, you must qualify as a U.S. Person as defined in 22 CFR § 120.62.

Purpose

The Yield Enhancement Engineer will drive yield improvement, defect reduction, process optimization, and new technology development for advanced packaging technologies. The role requires strong analytical capability, cross-functional collaboration, and hands-on experience with yield learning methodologies in high-volume manufacturing environments.

Responsibilities

• Analyze electrical, inline, defectivity, and reliability data to identify yield loss mechanisms and drive corrective actions.
• Develop and execute yield improvement plans for NPI and high-volume manufacturing products.
• Perform process integration studies across lithography, etch, deposition, CMP, plating, cleaning, and metrology modules.
• Correlate process parameters with yield, reliability, and device performance metrics.
• Drive root cause analysis using DOE, SPC, Pareto analysis, FMEA, and statistical methodologies.
• Support technology transfer from development to manufacturing with stable process windows and manufacturability improvements.
• Work closely with process, equipment, quality, product, reliability, and customer teams to resolve technical issues.
• Monitor excursion trends and establish preventive actions to improve process robustness.
• Define process control strategies, specifications, and yield monitoring methodologies.
• Participate in failure analysis reviews and develop containment/corrective action plans.
• Support customer qualification activities and technical discussions.
• Generate technical reports, presentations, and documentation for management and customers

Required Qualifications

• Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
• 3 years of semiconductor Process Integration or Yield Engineering experience.
• Strong understanding of semiconductor fabrication or advanced packaging process flows.
• Experience with statistical data analysis tools such as JMP, Minitab, Python, or Excel. Knowledge of SPC, DOE, Cp/Cpk, yield analysis, and defect reduction methodologies.
• Familiarity with electrical test data analysis and inline metrology correlation. Experience supporting NPI and high-volume manufacturing environments.
• Strong problem-solving and cross-functional communication skills.

Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Master's degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
• More than 3 years of semiconductor Process Integration or Yield Engineering experience.
• Experience in advanced packaging technologies such as hybrid bonding, TSV, Cu damascene, or wafer-level packaging.
• Knowledge of reliability failure mechanisms and FA techniques.
• Experience with automation/data visualization tools.
• Customer-facing technical support experience. Exposure to AI/ML-based yield analytics is a plus.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

• Uniforms and/or personal protection equipment (furnished)
• May work in all weather conditions
• May work in extreme temperatures
• May work around chemical fumes
• May work around standard office conditions
• May work around biohazards
• May work around chemicals
• May work around electrical and mechanical hazards
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)
• Climbing of stairs

Required Materials

• Letter of Interest
• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers: As a current university employee, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.