The Texas Institute for Electronics (TIE) is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogeneous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.
TIE is part of the Cockrell School of Engineering at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation's most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin — named “America's Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Cockrell School embodies the city's innovative spirit. Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders.
At UT Austin, we say “What starts here changes the world.” As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research. Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs.
UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:
Multiple vacancies available. This position may be filled at a higher-level title, relative to the experience and qualifications of the selected candidate. Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship. Relocation assistance may be available.
We are bringing advanced semiconductor 3DHI packaging/manufacturing back to the USA and looking for motivated individuals to join our team.
Design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading edge 2.5D & 3D packaging solutions. Support multi-material (Silicon, III-V, Glass…) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity…) design, modeling, and production.
Relevant education and/or industry experience may be substituted as appropriate.
TIE Pays Industry Competitive Salaries
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