Failure Analysis Engineer/Senior Failure Analysis Engineer, Texas Institute for Electronics Full-time

Failure Analysis Engineer/Senior Failure Analysis Engineer

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America's Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city's innovative spirit.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
• For more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human Resources

We are seeking a highly skilled and motivated failure analysis engineer to join our team. The successful candidate will be responsible for surface characterization analytical tools for detailed characterization of complex 3D semiconductor packages. This role involves working closely with a varied range of customers and an active collaboration across cross-functional teams, including materials, process engineering and design.

• Establish and responsible for surface science characterization tools for advanced package failure analysis & characterization.
• Direct engagement with the setup of the characterization facility at the Montopolis campus, including planning, procurement, and setup of equipment and infrastructure.
• Identify root cause of failures enabling process/recipe optimization and yield improvements in early production.
• Stay updated on industry trends, emerging technologies, and advancements in surface characterization analytical metrologies.
• Collaborate with external vendors and academic partners on the development of advanced characterization techniques to continuously improve lab capabilities and methodologies.
• Lead efforts to document design processes, methodologies, and results through Metrology Capability Reports and establish Best Known Methodologies.
• Perform other related functions as assigned.

Required Qualifications:

• Research Engineering/Scientist Associate IV: M.S. in Materials Science, Physics, Mechanical Engineering, or a related field with at least four years' of experience with surface science characterization tools.
• Research Engineering/Scientist Associate V: M.S. in Materials Science, Physics, Mechanical Engineering, or a related field with at least six years' of experience with surface science characterization tools.
• Proven track record of establishing and managing advanced research facilities.
• Excellent problem-solving skills and the ability to work independently and collaboratively.
• Strong communication skills to effectively interact with customers and team members.
• Demonstrated ability to innovate and develop new metrologies.

Preferred Qualifications:

• Ph.D. in Materials Science, Physics, Mechanical Engineering, or a related field.
• More than three years' of experience with surface science characterization tools.
• Experience working with defense companies and commercial semiconductor firms.
• Understanding of semiconductor technologies and wafer-level assembly processes.

TIE Pays Industry Competitive Salaries

• May work around chemical fumes
• May work around standard office conditions
• May work around chemicals
• May work around electrical and mechanical hazards
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)

Required Materials:

Resume/CV

3 work references with their contact information; at least one reference should be from a supervisor

Letter of interest